Aehr Test Systems Float d'actions

Quel est le Float d'actions de Aehr Test Systems?

Le Float d'actions de Aehr Test Systems est 0.000 0.00%

Quelle est la définition de Float d'actions ?

Le flottant des actions est la partie des actions d’une société qui est entre les mains d’investisseurs publics, par opposition aux actions immobilisées.

Shares float represents the portion of shares of a corporation that are in the hands of public investors as opposed to locked-in stock held by promoters, company officers, controlling-interest investors, or government. This number is sometimes seen as a better way of calculating market capitalization because it provides a more accurate reflection of what public investors consider the company to be worth. In this context, the float may refer to all the shares outstanding that can be publicly traded

The float is calculated by subtracting the locked-in shares from outstanding shares. Stocks with smaller floats tend to be more volatile than those with larger floats. In general, the large holdings of founding shareholders, corporate cross-holdings, and government holdings in partially privatized companies are excluded when calculating the size of a public float.

Que fait Aehr Test Systems?

headquartered in fremont, california, aehr test systems is a worldwide supplier of systems for burning-in and testing memory and logic integrated circuits and has an installed base of more than 2,500 systems worldwide. aehr test has developed and introduced several innovative products, including the abts, foxtm and max systems and the diepak® carrier. the abts system is aehr test’s newest system for packaged part test during burn-in for both low-power and high-power logic as well as all common types of memory devices. the fox system is a full wafer contact test and burn-in system. the max system can effectively burn-in and functionally test complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. the diepak carrier is a reusable, temporary package that enables ic manufacturers to perform cost-effective final test and burn-in of bare die.

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